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DF6A6.8FUT1Quad Array forESD Protection
This quad voltage suppressor is designed for applications requiringtransient overvoltage protection capability. It is intended for use involtage and ESD sensitive equipment such as computers, printers,business machines, communication systems, medical equipment, andother applications. Its quad junction common anode design protectsfour separate lines using only one package. These devices are ideal forsituations where board space is at a premium.
Specification Features
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123
654
••••••••••
SC−88 Package Allows Four Separate Unidirectional ConfigurationsLow Leakage < 1 mA @ 5 Volt
Breakdown Voltage: 6.4 − 7.2 Volt @ 5 mALow Capacitance (40 pF typical)
ESD Protection Meeting 61000−4−2 Level 4and 16 kV Human Body ModelPb−Free Package is Available
Void Free, Transfer−Molded, Thermosetting Plastic CaseCorrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board AssemblySmall Package Size for High Density Applications
MARKINGDIAGRAM6Mechanical Characteristics
SC−88CASE 419B−02168 M GGMAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Peak Power Dissipation @ 8 x 20 ms(Note 1)
Steady State Power Dissipation(Note 2)
Thermal Resistance −Junction−to−AmbientDerate Above 25°C
Maximum Junction TemperatureOperating Junction and StorageTemperature Range
ESD Discharge
MIL STD 883C − Method 3015−6IEC61000−4−2, Air Discharge
IEC61000−4−2, Contact DischargeLead Solder Temperature(10 seconds duration)
SymbolPpkPDRqJA
Value75385
UnitWattsmW
68= Specific Device CodeM= Date CodeG = Pb−Free Package(Note: Microdot may be in either location.)ORDERING INFORMATION
DeviceDF6A6.8FUT1
PackageSC−88SC−88(Pb−Free)
Shipping†3000/Tape & Reel3000/Tape & Reel
3283.0150−55 to+15016168
°C/WmW/°C°C°CkV
DF6A6.8FUT1G
TJmaxTJ, TstgVPP
†For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationsBrochure, BRD8011/D.
TL
260°C
Maximum ratings are those values beyond which device damage can occur.Maximum ratings applied to the device are individual stress limit values (notnormal operating conditions) and are not valid simultaneously. If these limits areexceeded, device functional operation is not implied, damage may occur andreliability may be affected.1.Per Waveform Figure 1
2.Mounted on FR−5 Board = 1.0 X 0.75 X 0.062 in.
© Semiconductor Components Industries, LLC, 20051
June, 2005 − Rev. 1
Publication Order Number:
DF6A6.8FUT1/D
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DF6A6.8FUT1
IIFVBRVRWMIRVFITV
V−I Curve
ELECTRICAL CHARACTERISTICS
Breakdown VoltageVBR @ 5 mA (Volts)Min6.4
Nom6.8
Max7.2
Leakage CurrentIRM @ VRWM = 5 V
(mA)1.0
TypicalCapacitance@ 0 V Bias
(pF)40
Max
VF @ IF = 10 mA
(V)1.25
MaxZZ @5 mA(W)30
MaxZZK @0.5 mA(W)300
DeviceDF6A6.8FUT1
DeviceMarking68
100% OF PEAK PULSE CURRENT90807060504030201000trPEAK VALUE IRSM @ 8 msPULSE WIDTH (tP) IS DEFINEDAS THAT POINT WHERE THEPEAK CURRENT DECAY = 8 msHALF VALUE IRSM/2 @ 20 msTYPICAL CAPACITANCE (pF)1 MHz FREQUENCY80504540353025201510
0
1
2
3
4
5
tP2040t, TIME (ms)
60BIAS VOLTAGE (VOLTS)
Figure 1. 8 × 20 ms Pulse Waveform
Ipp, PEAK PULSE CURRENT (AMPS)1
IF, FORWARD CURRENT (A)10Figure 2. Capacitance
0.1
8 x 20 ms per Figure 10.01
0.001
0.00010.60.70.80.91.01.11.21101112VF, FORWARD VOLTAGE (VOLTS)
VC, CLAMPING VOLTAGE (VOLTS)
Figure 3. Forward Voltage
Figure 4. Clamping Voltage versus Peak
Pulse Current
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DF6A6.8FUT1
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE VDeNOTES:
1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
2.CONTROLLING DIMENSION: INCH.
3.419B−01 OBSOLETE, NEW STANDARD 419B−02.
4DIMAA1A3bCDEeLHEMILLIMETERSMINNOMMAX0.800.951.100.000.050.10
0.20 REF0.100.210.300.100.140.251.802.002.201.151.251.35
0.65 BSC0.100.200.302.002.102.20
INCHES
NOMMAX0.0370.0430.0020.0040.008 REF0.0040.0080.0120.0040.0050.0100.0700.0780.0860.0450.0490.053
0.026 BSC0.0040.0080.0120.0780.0820.086MIN0.0310.000
65HE123−E−b6 PL0.2 (0.008)MEMA3ACA1LSOLDERING FOOTPRINT*
0.500.01970.650.0250.650.0250.400.01571.90.0748SCALE 20:1mmǓǒinchesSC−88/SC70−6/SOT−363
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
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DF6A6.8FUT1
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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