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专利名称：Electrode additive paste发明人：中山 剛成,成田 一貴,井上 翔平申请号：JP2018558360申请日：20180806
公开号：JPWO2019039254A1公开日：20191107
摘要：The present invention relates to an electrode binder resin made of a polyimideresin having a melting point of 300.degree. C. or less. The present invention relates to anelectrode binder paste for the electrode, an electrode compound paste containing anelectrode active material and a solvent, an electrode having an electrode containing layercontaining an electrode binder resin and an electrode active material, and a method ofmanufacturing the electrode.
申请人：宇部興産株式会社
地址：山口県宇部市大字小串１９７８番地の９６
国籍：JP
代理人：坂本 智弘
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