五一七教育网
您的当前位置:首页ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY M

ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY M

来源:五一七教育网
专利内容由知识产权出版社提供

专利名称:ELECTRONIC COMPONENT TERMINATION

AND ASSEMBLY BY MEANS OF TRANSIENTLIQUID PHASE SINTERING AND POLYMERSOLDER PASTES

发明人:MCCONNELL, James, E.,BULTITUDE,

John,PHILLIPS, Reggie,HILL, Allen,RENNER,Garry, L.,LESSNER, Philip, M.,CHACKO,Antony, P.,BELL, Jeffrey,BROWN, Keith

申请号:EP11787439.6申请日:20110526公开号:EP2577694A2公开日:20130410

摘要:A capacitor has first planer internal electrodes in electrical contact with a firstexternal termination. Second planer internal electrodes are interleaved with the firstplaner internal electrodes wherein the second planer internal electrodes are in electricalcontact with a second external termination. A dielectric is between the first planerinternal electrodes and the second planer internal electrodes and at least one of theexternal terminations comprises a material selected from a polymer solder and atransient liquid phase sintering adhesive.

申请人:Kemet Electronics Corporation

地址:2835 Kemet Way Simpsonville, SC 29681 US

国籍:US

代理机构:Goodman, Simon John Nye

更多信息请下载全文后查看

因篇幅问题不能全部显示,请点此查看更多更全内容