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专利名称：Wire bonding method for forming low-loop
profiles
发明人：Yam Mo Wong,Mow Huat Goh申请号：US11753957申请日：20070525公开号：US077800B2公开日：20100824
专利附图：
摘要：A method of forming a wire bond with a bonding tool is provided that
comprises the steps of forming a ball bond onto a bonding surface, raising the bondingtool away from the ball bond to form a neck portion integrated with a top of the ball
bond, locating a circumference of a tip of the bonding tool onto the neck portion,pressing the neck portion with the circumference of the tip to form a depression in theneck portion without bonding the neck portion to the ball bond, and thereafter raisingthe bonding tool away from the ball bond.
申请人：Yam Mo Wong,Mow Huat Goh
地址：Singapore SG,Johor MY
国籍：SG,MY
代理机构：Ostrolenk Faber LLP
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